N8 Research Partnership
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N8 Research Partnership
Wafer Scribing Equipment
Process Equipment - Physical
Packaging
Dicing
featured
Description
It cleaves semiconductor wafers into smaller samples. Facility: National Graphene Institute
Manufacturer
JFP MICROTECHNIC
Model
S200-8
Location
Main Campus
National Graphene Institute
Contact
Academic Contact
Andre Geim
Andre.K.Geim@manchester.ac.uk
+44-161-275-4120
Technical Contact
Ernest Hill
e.w.hill@manchester.ac.uk
+44-161-275-4552