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N8 Research Partnership
Wafer Bonding System
Process Equipment - Physical
Packaging
Wafer/Chip Bonding
Manufacturer
APPLIED MICRO ENGINEERING LTD
Model
AML-AWB-04
Location
University of Leeds (Identifier: 1)
Faculty of Engineering
Academic Units
School of Electronic & Electrical Eng
Contact
Academic Contact
Prof Prof Edmund Linfield
e.h.linfield@leeds.ac.uk
+44-113-34-32015
Technical Contact
Mr Mr Jordan Thomas
j.thomas@leeds.ac.uk
+44-113-343-2120