The wafer scriber cuts semiconductor wafers into small pieces with a diamond scriber. The Karl Suss wafer scriber has a 3” wafer chuck and x-y movement with resolution of 10 microns step. It is a manual operated system that can scribe semiconductor wafers such as Si, GaAs.
Prof Prof Edmund Linfield | |
e.h.linfield@leeds.ac.uk | |
+44-113-34-32015 |
Dr Dr Li Chen | |
l.chen@leeds.ac.uk | |
+44-113-34-35215 |