Description
The Mask aligner is for UV lithography, a microfabrication process to selectively remove parts of a thin film of photoresist on a substrate. It uses UV light to transfer a geometric pattern from a photomask to a light-sensitive photoresist on the substrate. Sub-micron size features can be created after a series of chemical developments and thermal treatment. Our SUSS MJB3 has a mercury lamp providing NUV spectrum ranging from 350 nm to 450 nm and can handle 2” wafers such as Si, GaAs semiconductor as well as other flat substrate.
