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Auto Stepback Wedge Bonder
Process Equipment - Physical
Packaging
Wire Bonding
featured
Description
The equipment is a wire bonder, attaches wires to small devices.
Manufacturer
KULICK & SOFFA INDUSTRIES INC.
Model
4526
Location
University of Leeds (Identifier: 1)
School of Physics and Astronomy
Faculty of Maths & Physical Sciences
Condensed Matter
Contact
Academic Contact
Dr Dr Gavin Burnell
g.burnell@leeds.ac.uk
+44-113-34-33843
Technical Contact
Dr Dr Mannan Ali
phyma@leeds.ac.uk
+44-113-34-33833