Rapid thermal annealer provides heat treatment to semiconductor wafers to high temperatures (up to 1,000°C or greater) in a short time of seconds or minutes before cooling down. The thermal processes are used for a variety of applications such as dopant activation, metal diffusion. An example, AS - one Furnace can ramp up to 420°C from room temperature in 1.5 minutes.
Prof Prof Edmund Linfield | |
e.h.linfield@leeds.ac.uk | |
+44-113-34-32015 |
Dr Dr Li Chen | |
l.chen@leeds.ac.uk | |
+44-113-34-35215 |